PCB milling
Component placement
Soldering
Introduction » Component placement
Component placement and solder paste application
Mipec offers low-cost and proven P&P systems for manual dispensing or stencil printing of solder paste and SMD placing of components to assembly PCB prototypes. SMD manipulators can be equipped with dispensing head, which allows application of SMT glue or solder paste. Thanks its dimensions ,low weight and zero noise level these systems are suitable for all laboratories or development offices where fast pcb assembling is required. There are also systems with camera, which helps with faster placing and orientation over the PCB during and after placing or dispensing.
Systems can be equipped with numerous accessories. If you are not sure with system configuration, please feel free to contact us. We'll find solution for you.
For price information, please, contact us or your local distributor
P2J-4P-VIS
In stock
For price information, please, contact us or your local distributor
P2J-4PRINT
In stock