Introduction » Soldering » Reflow oven HR-10LF
Industry 4.0 ready, Bluetooth communication
IR + convection heating.
- Android application for connecting to Tablet or Smartphone
- 100 various users programs
- Solder dumps exhaust integrated inside reflow chamber
Oven description: Benchtop Reflow oven with IR and convection heating. Forced hot-air convection ensures uniform temperature profile in whole chamber. After door opening are cooling fans switched on and cool-down soldered PCB quickly.
Connect oven to electrical power and dump exhaust to exhaust system. After first switch-on oven is searching for paired Tablet or Smartphone. When both are connected in Android App you choose programing of oven. Here are programmable temperature and time of preheating as well as temperature and time for soak
and other data.
When oven is already programmed user can control process with buttons and display on front panel. There is acoustic signal started when reflow process is over. The same signal is appeared in Tablet/Smartphone.
Android application displays process status, time and temperature or other info. Application for IOS systems is planed.
|Power supply||230 V, 50 Hz|
|Energy consumption||max. 3100 W|
|Current consumption||max 20A|
|Heating units||4 x 1000 W linear radiant heaters|
|Amount of profiles||98|
|Max temperature||270 °C|
|Max drying temperature||150 °C|
|Max preheating time||999 s|
|Max reflow time||999 s|
|Max drying time||9999 min|
|Workspace dimensions||320 x 220 mm|
|Grid tray dimensions||360 x 220 mm|
|Oven dimensions (l x w x h)||505 x 370 x 340 mm|
|Cover degree||IP 30|